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This microscope is used to observe large chips, and it's amplification factor is 3x to 18x. |
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Metallurgy Microscope The metallurgy microscope is used to observe the EP structure detailed geometry and its trace distributions. The amplification factor is 50x to 1000x.
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Grinder/Polisher
In order to observe EP chip, the grinder/polisher is used to grin the chip surface, and then the chip is observed by microscopes.
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The precise balance is used to measure the chip's weight. The resolution is up to 0.1 micro-gram!
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The ball shear tester has a hard tip to push solder balls till they failed. The failure modes reveal the strength and reliability of shear balls.
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The shadow Moire interferometry is used to measure displacement of a chip. When the surface of test chip has out-of plane displacement, it will result some interfere fringes. The intervals between these fringes represent 0.5 μm.
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The high speed camera is used to observe some transient information such as the drop test, or the liquid surface tension effect.
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This cleaner is used to clean dirt on chip surface.
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Diamond
Cutter
The diamond cutter is used to cut the whole chip to observe the inner structure of the chip. |
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The Twyman-Green Interferometry is used to measure the out-of-plane displacement of chip surface induced by thermal loading. Moreover we could get the strain or the gradient by interfere fringe distribution.
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Heating Oven This equipment is to simulate the solder reflow process or to test thermal reliability of chips.
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Three Dimensional Measure Machine The three dimensional measure machine could obtain the three dimensional geometry of chip. Currently we use it to measure the height of solder balls.
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The rework station is used to proceed solder reflow process or rework process.
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The drop test vehicle is composed of by the drop table, rigid base, and the lifting system. The test board is mounted on the drop table, and then freely dropped along the connecting rods. |
Computational Solid Mechanics Software：
Below are the FEM software listing in CSML :
ANSYS®:
ANSYS® is the most widespread calculational solid mechanics FEM software in industrial field. It could simulate stress-strain analysis on various 3D elements, like beam elements, shell elements, plate elements, and so on. Moreover, it could be applied to calculate on temperature field, fluidic field, or electromagnetic field.
MSC/NASTRAN:
Like ANSYS®, MSC/NASTRAN is another generalized FEM software. It provides lots of functions to solve mechanical engineering problems such as stress, strain, thermal conduction, vibration, buckling..... It is well known about its superior eigenvalue solver and the accuracy of statistic problem solutions.
LS-DYNA 3D:
For the most part, LS-DYNA 3D is to solve transient problems, especially on highly non-linear transient analysis. It could solve including contact impact problems, fluidic transient problems, fluidic-solid coupling problems..... Moreover, it is also suitable on cracking analysis, forging analysis, crashworthiness engineering simulation, explosion analysis.
LS-NKIE 3D:
This is also a 3D non-linear FEM software. It not only solves general static problems, but also solves contact or impact problems by implicit mehtod.
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