Electronic Packaging Reflow Shape Prediction for The Solder Mask Defined BGA
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Schematics of an Axisymmetric Solder Joint
Governing Equation
Comparison of Energy and Analytical Methods
The Influence of the upper pad size to the solder joint geometric parameters
Comparison of Different Mesh Model
Vertices Deviation Distribution at Pad Size Ratio = 0.5
Comparison of Vertices Deviation for Various Pad Size Ratio
Comparison of Vertices Deviation for Different Pad Size
Comparison of Vertices Deviation for Larger Solder Volume
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