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Development of Next Generation Package System

Chip Scale Package, Wafer Level Packaging and Flip Chip will be the Better Solution for The

Next Generation Packaging System

Research on Chip Scale and Wafer Level Packaging are more Suitable for Mechanical Engineering

Key Research Issues Required for Flex CSP and Wafer Level Packaging

Manufacturing Infrastructure

IC Factory (XXXX、XX）

Packaging House（XXXX、XX）

Flex Circuit （XXXX、XX）

Surface Mount Technology（XX）

其他（XX）

Research Infrastructure

Solid Mechanics -- Fracture, Visco/Plastic,

Thin Film Mechanics,

Statistic Mechanics,

Liquid Formation, etc.

Material Science -- Material Characterization,

New Materials

Manufacturing and Automation

Heat Transfer

MEMS

Etc.