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Solder Alloy Consideration for BGA

Alloy

63Sn/37Pb

62Sn/36Pb/2Ag

62Sn/36Pb/2In

95.5Sn/3.5Ag

95Sn/3.5Ag/1.5In

25In/75Pb

10Sn/90Pb

Liquidus Temp.

183 oC

179 oC

179 oC

221 oC

218 oC

264 oC

325 oC

* Solder alloy is typically heated 30-50 oC above the liquidus temp. of the material to

complete the wetting characteristic needed for jointing

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