國立清華大學電子構裝/電腦輔助工程實驗室

Electronic Packaging / CAE Research Labs. of National Tsing Hua University

　

Kuo-Ning Chiang, Associate Professor

　

Chip Scale/Wafer Level Packaging

　

Fujitsu BCC

　

Tessera microBGA

　

Sharp FBGA

　

　CSP Status in Japan/Korea (01/98)

　

　All of the information of this web page is for member only, if you would like to joint the EP member of electronic packaging lab. of national Tsing Hua university, you may send an e-mail to professor Kuoning Chiang (knchiang@pme.nthu.edu.tw ) for details.

　

　 CSP Market Prediction

Taiwan Semiconductor Industry links (台灣半導體工業相關網頁)