PowerPoint 簡報
Existing Analysis Approaches for Electronic Packages
- 2-D Plain Stress/Strain Approach [Lau, 1992; Jahsman, 1993; Mckeown, 1993;
=>Less accurate and can not identify the most susceptible solder joint
- Analytical Approach [Borgessen, 1992]
=>Can not handle complicated material/geometry configuration
- 3-D Sliced Finite Element Model [Nagarajand, 1993]
=>Less accurate and can not simulate all the solder joints
=>Incredibly CPU time consuming and less efficient
- Local/Global (namely, Micro/Macro) Approach:
(1) Rule of Mixture, (2) Self-Consistent Method, (3) Homogenization Method,
(4) Finite Element Approach (preferred Choice)
Local/Global Finite Element Approach [Corbin, 1993; Ju, 1995]
=>Much more efficient than Full-Scaled 3-D approach with appropriate accuracy.