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Global Analysis of PBGA (36 Solder Balls)

CSML

The Material Properties Used in the PBGA Package

The Geometry Data Used in the PBGA Package(mm)

Young’s Poisson CTE

Modulus(Mpa) Ratio (ppm)

Silicon Chip 130,000 0.28 2.62

BT 19,000 0.2 15

FR-4 18,200 0.19 16

Silicon Chip BT FR-4

9x8x0.36 (mm) 14x13x0.36 14x13x1.71

1/4 of PBGA Finite Element Model