Conclusions
An equivalent Beam Theory is Derived for Area Array Package Analysis
A Mesh Density independent Method is developed for Coffin-Mason and Energy Density Based Reliability Theories
A Liquid Formation Methodology is Developed for Solder Ball Reflow Shape Prediction
The 2nd Reflow Process Could Significantly Increase the Reliability Life Cycle for Area Array Type Packages
Pad Geometry is Very Important for Packages Reliability. Good Pad Design Could Reduce the Manufacturing Cost and Increase the Reliability of the Package
Liquid Formation Methodology Studied in This Research Could Applied to any Kind of Formation Geometry/Boundary Constraint