Advanced Packaging Design
3D/Stack Packaging Design
Micro-Bumping Technology
High Density Packaging Design
Flip Chip, Chip Scale and Wafer Level Packaging Design
Chip-On-Glass, ACA/ACF, NCF, ICA Process Modeling
Non-linear, Temperature Dependent, Finite Element Methods
Impact/Crashworthness, Contact and Drop Test
Laser, Shadow and Twyman-Green Moire’
Warpage, Stress/Strain, Delamination and Crack, etc.
Shearing Stress, Intermetallic Compound, Grain Boundary
Geometry, Restoring Force Prediction
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