E-mail:d883783@oz.nthu.edu.tw
相關著作：
Journal Paper
Chiang, K. N., Chang C. W. and Lin C. T., “Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Package,” TRANSATIONS of the ASME, Journal of Electronic Package, Vol. 123, pp. 331-337, 2001.
Lin, C. T. and Chiang, K. N., “Reliability Analysis of Flip Chip Packages Using the Contact Finite Element Method,” Journal of the Chinese Institute of Engineers, Vol. 27, No. 2, pp.165-172, 2004.
Conference Papers
Chiang, K.N. Chang C. W. and C. T. Lin, “Process and Reliability Simulation of Flip Chip using ACF", Proceeding of EPTC 2000 (IEEE, EI), pp. 110-116, Dec. 2000, Singapore.
Lin, C. T. and Chiang, K. N., "Reliability Analysis of Flip Chip Packages Using the Contact Finite Element Method", Published (CD-ROM) at Annual Meeting of CSME, Nov. 8, 2001, Taipei.
Peng, C. T., Lin, J. G., Lin, C. T and Chiang, K. N., "Investigation of Thermal Effect of Packaged CMOS Compatible Pressure Sensor", Published at 2002 ASME Intl. Mechanical Engineering Congress and Exposition, Symposium on Microelectronic Manufacturing, Reliability, and Quality Assurance Testing, Nov. 17-22, 2002, New Orleans, USA.
Lin, C. T., Peng, C. T., Lin, J. C. and Chiang, K. N., “Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor”, Published at InterPACK2003 (IEEE/ASME), June 30 – July 5, Hawaii, USA.
J. Y. Chen, C. T. Lin, W. C. Liao, H. C. Su, C. H. Ysai and K. N. Chiang, “A New Nano-Probe Using Micro Assembly Transfer”, Published at 3rd Cross-Strait Workshop on Nano Science & Technology, April 27 – 29, 2004, HuaLian, Taiwan.
C.T. Lin, W.C. Liao, J.Y. Chen, H.C. Su and K.N. Chiang , “Design and Analysis of Nano-Probe of AFM Using Large Deflection Theory “, 3rd Cross-Strait Workshop on Nano Science & Technology, April 27 – 29, 2004, HuaLian, Taiwan.
Chen, J. Y., Lin, C. T., Liao, W. C., Su, H. C., Tsai, C. H. and Chiang, K. N., “A New Nano-Probe Using Micro Assembly Transfer”, Published at First International Nano Bio-Packaging Workshop, March 22-23, 2004, Atlanta.
C. T. Lin, W. C. Liao, J. Y. Chen, H. C. Su and K. N. Chiang, “Design and Analysis of a Nano-Probe for the AFM based on the Small/Large Deflection Theory,” Published at 2004 ASME Intl. Mechanical Engineering Congress and Exposition, Nov. 13-19, 2004, Anaheim, USA.
W. C. Liao, C. T. Lin and K. N. Chiang, “Experiment Validation of a Nano-Probe for the AFM based on the Large Deflection Theory,” Published (CD-ROM) at Annual Meeting of CSME, Nov. 11, 2004, KaoHsiung.
參與計畫：
l 樺晶科技公司-新型微壓力感測器研發與製造
l 華擎計畫-引擎汽缸熱傳分析與設計 (2001/04-2002/03)
l 工業技術研究院電子工程研究所構裝製程技術組-專利工程師
l 工業技術研究院電子工程研究所-自主性前瞻計畫-原子力顯微鏡之奈米探針設計與分析
專利：
- 低熱應力與高靈敏度點對點接合之微感測器結構（中華民國專利，發明第一六五四二八號）
- 矽材壓力微感測元件及其製造方法 （中華民國專利，公告號500916）