E-mail:d917716@oz.nthu.edu.tw
相關著作：
1. Lee, C. C., Chiang, K. N., 2003, “Design and Reliability Analysis of Wafer Level Package with Bubble-Like Buffer Layer,” 2003 International Electronic Packaging Technical Conference and Exhibition, Vol. 2, pp.813-818, Maui, Hawaii, USA, Jul. 6-11.
2. Peng, C. T., Lee, C. C., and Chiang, K. N., 2003, “Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies,” ASME International Mechanical Engineering Congress & Exposition, Vol. 3, pp.43-49, Washington, D.C., USA, Nov. 15-21.
3. Lee, C. C., Chiang, K. N., Chen, W. K., and Chen, R. S., 2003, “Design and Analysis of Temperature Distribution for 2.0L Cylinder Head in Engine Operation,” The 20th National Conference on Mechanical Engineering, Vol. 3, pp.1189-1196, CSME, Taipei, Taiwan, Dec. 5-6.
4. Lee, C. C., Chiang, K. N., Chen, W. K., and Chen, R. S., 2003, “Design and Analysis of Gasket Sealing for Cylinder Head in 2.0L Engine Operation,” Paper #G225, The 27th Conference on Theoretical and Applied Mechanics, Tainan, Taiwan, Dec. 12-13.
5. Lee, C. C., Liu, H. C., and Chiang, K. N., 2004, “3D Structure Design and Reliability Analysis of Wafer Level Package with Bubble-Like Stress Buffer Layer,” 9th Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems (ITHERM 2004), Las Vegas, USA, Jun. 1-4.
參與計畫：
1. 裕沛科技/清華大學合作案：Wafer Probe card與Wafer Level Packaging研發計畫（2001/07~2001/12）.
2. 華擎機械工業股份有限公司委託學術機構研究計畫：汽缸頭結構最佳化分析研究轉委託計畫（2002/08~2003/07）.
3. 工業技術研究院電子工業研究所專利搜尋：COG相關結構、製程專利（2003/01~2003/06）.
4. 工業技術研究院電子工業研究所專利搜尋：Wafer Probe card相關結構、製程專利（2003/07~2003/12）.
5. 工業技術研究院電子工業研究所專利搜尋：COG、NCP模組相關專利（2004/01~迄今）.
6. 工業技術研究院電子工業研究所自主性前瞻計畫（微液相成型混合理論應用於晶圓級封裝可靠性與微結構體自動組裝研發）：5X/16X Product Design and Development Procedure，WLCSP參數化分析與設計開發（2003/05~迄今）.
專利：
1.
楊文焜,
楊文彬,
王誌榮,
林明輝,
孫文彬,
吳皓然,
江國寧,
李昌駿,
廖啟銘,袁長安,
“晶圓級測試卡之探針結構”
本案獲台灣發明專利,
公告號：531,645,
證書號：177,789,
May 11, 2003.
2.
袁長安,
李昌駿,
廖啟銘,
江國寧,
“具複數個接觸單元之電訊測試組件結構”
本案獲台灣發明專利,
公告號：516,150,
證書號：170,790,
Jan. 1, 2003.