韓政男

E-mail:d927715@oz.nthu.edu.tw

相關著作:

  1.  C. A. Yuan, C. N. Han, M. C. Yew, C. Y. Chou and K. N. Chiang, "Design, Analysis and Development of Novel Three-Dimensional Stacking WLCSP," accepted by IEEE Transaction of Advanced Packaging.

  2. C. A. Yuan, C. N. Han and K. N. Chiang , “Design and Analysis of Novel WLCSP Structure”, EuroSIME2004 International Conference, May 9-May 12, 2004, Brussels, Belgium.

  3. C. A. Yuan, C. N. Han and K. N. Chiang, "Atomistic to Continuum Mechanical Investigation of ssDNA and dsDNA using Transient Finite Element Method," Inter-Pacific Workshop on Nanoscience and Nanotechnology, Nov. 22-Nov. 24, City University of Hong Kong, Hong Kong SAR.

參與計畫:

  1. 裕沛科技公司-WLCSP與WLPC開發及驗證