Chou Chan-Yen, James

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Graduate Student, Adviser: Prof. K. N. Chiang

Advanced Microsystem Packaging and Nano-Mechanics Research Lab.

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Dept. of Power Mechanical Engineering,

National Tsing Hua University, Hsin Chu, Taiwan, R. O. C.

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¡@	¡mThesis¡n    Investigation of mechanical properties of atomic structure using atomistic-continuum mechanics method.
¡@	¡mPublished Paper¡n ¡@ Journal Paper: ¡P C. J. Wu, C. Y. Chou, C. N. Han, and K. N. Chiang, "Estimation and Validation of Elastic Modulus of Carbon Nanotubes Using Nano-Scale Tensile and Vibrational Analysis," Computer Modeling in Engineering and Science, Vol. 41, No. 1, pp. 49-68, 2009. ¡P K. N. Chiang, C. Y. Chou, C. J. Wu, C. J. Huang, and M. C. Yew, "Analytical solution for estimation of temperature-dependent material properties of metals using modified Morse potential," Computer Modeling in Engineering and Science, Vol. 37, pp. 85-96, 2008. ¡P C. Y. Chou, T. Y. Hung, S. Y. Yang, M. C. Yew, W. K. Yang, and K. N. Chiang, "Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact," Microelectronics Reliability, Vol. 48, pp. 1149-1154, 2008. ¡P M. C. Yew, C. Y. Chou, and K. N. Chiang, "Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis." Microelectronics Reliability, Vol. 47, pp. 1658-1662, 2007. ¡P K. N. Chiang, C. Y. Chou, and C. J. Wu, and C. A. Yuan, "Prediction of The Bulk Elastic Constant of Metals Using Atomic-Level Single-Lattice Analytical Method" Appl. Phys. Lett. 88, 171904, 2006. ¡P M. C. Yew, C. Y. Chou, C. S. Huang, W. K. Yang, K. N. Chiang, "The Solder on Rubber (SOR) Interconnection Design and Its Reliability Assessment Based on Shear Strength Test and Finite Element Analysis," Journal of Microelectronics Reliability, Vol. 46, 2006. ¡P K. N. Chiang , C.A. Yuan, C. N. Han, C. Y. Chou and Yujia Cui,"Mechanical Characteristic of ssDNA/dsDNA Molecule Under External Loading", Appl. Phy. Lett., 88, 023902, 2006, also published in the January 23, 2006 issue of Virtual Journal of Nanoscale Science & Technology. ¡P C. A. Yuan , C. N. Han, M. C. Yew, C. Y. Chou and K. N. Chiang, ¡§Design, Analysis and Development of Novel Three-Dimensional Stacking WLCSP,¡¨ IEEE Transaction of Advanced Packaging, Vol 28, No. 3, pp. 387-396, Aug. 2005. Conference Paper: ¡P C. Y. Chou, C. J. Huang, M. Sano, and K. N. Chiang, "Metal trace impact life prediction model for stress buffer enhanced package," 17th European Microelectronics and Packaging Conference & Exhibition (EMPC2009), Rimini, Italy, June 15-18, 2009. ¡P T. Y. Hung, M. C. Yew, C. Y. Chou, and K. N. Chiang, "A study of thermal performance for chip-in-substrate package on package," 17th European Microelectronics and Packaging Conference & Exhibition (EMPC2009), Rimini, Italy, June 15-18, 2009. ¡P Masafumi Sano, Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang, ¡§Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test¡¨, International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE2009), Delft, Netherlands April 27-29, 2009 ¡P C. J. Huang, C. Y. Chou, K. N. Chiang, ¡§Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module¡¨, International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE2009), Delft, Netherlands April 27-29, 2009 ¡P T. Y. Hung, C. Y. Chou, M. C. Yew and K. N. Chiang, ¡§Validation and reliability assessment of board level drop test of chip-scale-packaging,¡¨ The International Conference on Experimental Mechanics 2008 (ICEM2008), Nanjing, China, November 8-11, 2008. ¡P C. Y. Chou, T. Y. Hung, M. Sano, S. Y. Yang, and K. N. Chiang, "Investigation of influences of PCB on board-level drop test by dynamic simulation and modal analysis," 3rd IMPACT, Oct. 22-24, Taipei, Taiwan. ¡P C. Y. Chou, T. Y. Hung, S. Y. Yang, M. C. Yew, W. K. Yang, and K. N. Chiang, "Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact," ESREF2008, 30 Sep. - 03 Oct., Maastricht, Netherland. ¡P S. Y. Chiang, S. Y. Yang, C. Y. Chou, M. C. Yew, and K. N. Chiang, "Reliability Analysis of Copper Interconnections of System-in-Packaging Structure using Finite Element Method," ICEPT-HDP2008, 28-31 July, Shanghai, China.   ¡P C. Y. Chou, T. Y. Hung, M. C. Yew, W. K. Yang, D. C. Hu, M. C. Tsai, C. S. Huang, and K. N. Chiang, "Investigation of Stress-buffer-enhanced Package Subjected to Board-level Drop Test," EuroSimE2008, 20-23 April, Freiburg im Breisgau, Germany. ¡P S. Y. Chiang, C. Y. Chou, M. C. Yew, and K. N. Chiang, "Reliability Analysis of Copper Interconnection in System-in-package Structure," International Conference on Electronics Materials and Packaging (EMAP2007), November 19-22, 2007, Daejeon, Korea. ¡P C. J. Huang, C. Y. Chou, C. J Wu, and K. N. Chiang, "Investigation of the mechanical properties of nano-scale metallic crystal structural with point defects," European Nano System 2007 (ENS'07), December 3-4, 2007, Paris, France ¡P C. Y. Chou, C. J. Wu, H. P. Wei, M. C. Yew, C. C. Chiu, and K. N. Chiang, "Thermal management on hot spot elimination / junction temperature reduction for high power density system in package structure," InterPACK 2007, July 8-12, 2007, Vancouver, BC, Canada. ¡P Chan-Yen Chou, Chung-Jung Wu, Hsiu-Ping Wei, Ming-Chih Yew, Chien-Chia Chiu and Kuo-Ning Chiang, "Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density RF Multi-chip Module," Thermal Stress 2007, June 4-7, 2007, Taipei, Taiwan. ¡P C. N. Han, C. Y. Chou, and K. N. Chiang, "Investigation of Mechanical Strength of The Nanoshell of Bacteriophage Phi-29," NSTI Nanotech2007, May20-24, 2007, Santa Clara, USA. ¡P C. N. Han, C. Y. Chou, and K. N. Chiang, "Investigation of dsDNA Molecule Mechanical Behavior Using Atomistic Continuum Mechanics Method," NSTI Nanotech2007, May20-24, 2007, Santa Clara, USA. ¡P C. J. Wu, C. Y. Chou, C. N. Han, and K. N. Chiang, "Simulation and Validation of CNT Mechanical Properties ¡V The Future Interconnection Material.", Electronic Components and Technology Conference (ECTC 2007), May 30 - Jun. 1, Reno, USA. ¡P Chun-Te Lin, Chan-Yen Chou, and Kuo Ning Chiang, "Estimation and validation of mechanical properties of single crystal silicon by atomic-level numerical model," International Conference on Experimental Mechanics (ICEM13), Alexandroupolis, Greece, July1-6, 2007. ¡P Chun-Te Lin, Chan-Yen Chou, Chao-Jen Huang, and Kuo-Ning Chiang, "Validation of mechanical properties of the nanoscale single crystal IV-A group material by Atomistic-Continuum Mechanics Model," The 30th Conference of Theoretical and Applied Mechanics, 2006 12/15~12/16, Taiwan. ¡P Cadmus Yuan, Chan-Yen Chou, Cheng-Nan Han, Ming-Chih Yew and Kou-Ning Chiang,"12" to 8" wafer transformationn technique using novvel glass WLCSP structure," Proceedings of the IMAPS-Taiwan 2006 Technical Symposium, June 28 - July 1, 2006, Taipei World Trade Center, Taipei, Taiwan. ¡P C. Yuan, G. Q. Zhang, C. S. Huang, C. H. Yu, C. C. Yang, W. K. Yang, M. C. Yew, C. Y. Chou and K. N. Chiang, "Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP," Proceedings of the 7th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSIME2006, Como (Milano), Italy, April 23 - 26, 2006, pp. 619-625. ¡P Chien-Chia Chiu, Chung-Jung Wu, Chih-Tang Peng, Chan-Yen Chou and Kuo-Ning Chiang , "Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package," EuroSimE2006 international Conference, 2006,in Como (Milano), Italy. ¡P Chung-Jung Wu, Chan-Yen Chou, Cheng-Nan Han, Kuo-Ning Chiang, ¡§Investigation of Carbon Nanotube Mechanical Properties Using The Atomistic-Continuum Mechanics Method.¡¨, NSTI Nanotech 2006, Boston, Massachusetts ( USA), 2006. ¡P C. N. Han, C. Y. Chou, C. J. Wu and K. N. Chiang, ¡§Investigation of ssDNA Backbone Molecule Mechanical Behavior Using Atomistic-Continuum Mechanics Method¡¨, NSTI 2006 Nanotechnology Conference, May 7-11, 2006, Boston, Massachusetts, U.S.A. ¡P C. Yuan, C. N. Han, C. Y. Chou, M. C. Yew and K. N. Chiang, "Simulation of unzipping dsDNA mechanical response using Clustered Atomistic-Continuum Method." ICCES'05 International Conference, Dec. 1-6, 2005, in Chennai, India. ¡P Chan-Yen Chou, Cadmus Yuan, Chung-Jung Wu and Kuo -Ning Chiang, "Numerical Simulation of the Mechanical Properties of Nanoscale Metal Clusters Using the Atomistic-Continuum Mechanics Method.", European Nano System 2005, 14-16 December 2005, Paris, France. ¡P C. H. Chang, C. Y. Chou, C. N. Han, C. T. Peng, K. N. Chiang, ¡§ Local-Strain Effect of the SiNx/Si Stacking and Nano-Scale Triple Gate Si/SiGe MOS Transistor¡¨, published at Microelectronics, MEMS, and Nanotechnology 2005 (SPIE), Brisbane, Australia, Dec. 11¡V14 2005. ¡P C. Y. Chou, C. A. Yuan, and K. N. Chiang, "Investigation of Nano-scaled Material Behavior Using Atomistic-Continuum Mechanics Method." The 22nd National Conference on Mechanical Engineering, CSME, Nov. 25-26, C11-006, 2005. ¡P C. H. Chang, C. Y. Chou, C. T. Peng, C. N. Han, and K. N. Chiang, ¡§Investigation of Local-Strain Effect of the Nano-Scale Triple Gate Si/SiGe and SiNx/Si Stacking MOS Transistor.¡¨ NSTI Nanotechnology Conference, May 8-12, 2005, Anaheim, California, U.S.A. ¡@
¡@	¡mConference Attendance¡n 2009. 06 EMPC2009, Rimini, Italy 2008. 10 3rd IMPACT, Taipei, Taiwan 2008. 10 ESREF2008, Maastricht, Netherland. 2008. 04 EuroSimE2008, Freiburg im Breisgau, Germany 2007. 07 ICEM13, Alexandroupolis, Greece 2007. 06 Thermal Stress 2007, Taipei, Taiwan. 2006. 12 Taiwan-U.S. Joint Workshop, Taipei, Taiwan. 2006. 11 5th Asian-Australasian Conference on Composite Materials (ACCM-5), HongKong, Hong Kong SAR. 2006. 07 Proceedings of the IMAPS-Taiwan 2006 Technical Symposium, Taipei World Trade Center, Taipei, Taiwan. 2006. 04 The 7th IEEE EuroSimE Conference, Como, Italy. 2005. 12 The 29th National Conference on Theoretical and Applied Mechanics, HsinChu, Taiwan 2005. 11 The 22nd National Conference on Mechanical Engineering Conference, CSME, Taiwan. 2005. 04  The 6^th IEEE EuroSimE Conference, Berlin, Germany. 2004. 11  The 21^st National Conference on Mechanical Engineering, The Chinese Society of Mechanical Engineers, National Sun Yat-Sen University, KaoHsiung. 2004. 07 Taiwan International Conference on Nano Science and Technology, National Tsing Hua University, HsinChu. 2004. 04  3rd Cross-Strait Workshop on Nano Science ¡® Technology,  National Dong Hua University, HuaLian. 2003. 07  InterPACK2003 International Conference, Hawaii, USA.
¡@	¡mProject Experiment¡n 2009.04~now          ¥x¹F¹qpµe¦X§@®×,¥H¯}Ãa¤O¾Ç²z½×¤Î¼ÒÀÀ¤ÀªRªk¹w¦ô¹q¤O¼Ò²Õªº±µÂI¥i¾a«×¬ã¨s 2007.08~2008.07 ¨|讬ì§Þpµe¦X§@®×, The Drop Test Analysis of Novel Slide-able Cu Trace Wafer Level Chip Scale Package 2006.08~2007.07     ¨|讬ì§Þpµe¦X§@®×, Optimal Design and Reliability Analysis for Heat Dissipation Structure of Wafer Level Multi-chip Module 2005.04~2006.07     ¨|讬ì§Þpµe¦X§@®×, The Reliability Analysis of Novel Slide-able Cu Trace Wafer Level Chip Scale Package 2005.01~2006.02     ¥x¿n¹q¬ã¨spµe¡ÐLow-k/Copper Interface 2004.12~2009.06     ¤u¬ã°|±M§Q·j´M 2004.02~2007.07     ¦æ¬F°|°ê®a¬ì¾Ç©eû·|©`¦Ì°ê®a«¬¬ì§Þpµe §Q¥Î³æ¤À¤l¾Þ±±³N¶i¦æDNA©`¦Ì¾¯¶q¤§³Ð·s¬ã¨s 2004.04~2004.05    ¸Î¨K¬ì§Þ¬ã¨spµe¡ÐWLCSP 2003.08~2004.12    ¤u¬ã°|¦Û¥D©Ê«e¤pµe¡Ð5X/16X¸ê®Æ®w³]p

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