|
|
Y. F.
Su
E-mail:
yenfusu@gmail.com
Journal Papers
|
|
K.C. Lin, C.C. Tsai,
Y.F. Su, T.Y. Hung, K.N. Chiang, "Analysis of LED Wire Bonding
Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration
Methods", iMPACT2013, Taipei,Taiwan, Oct 23-25, 2013
|
|
|
C. F. Huang, Y. F. Su, C. B. Lin,
and K. N. Chiang,"Research on the degradation of AlGaInP Ultra High
Brightness LEDs influenced by ohmic metal design," Microelectronic
Engineering 2013, accepted and to be published.
|
|
|
Chang-Chun Lee, Yen-Fu Su,
Chih-Sheng Wu, and Kuo-Ning Chiang, "Investigation of interconnect design on
interfacial cracking energy of Al/TiN barriers under a flexural load," Thin
Solid Films, Volume 544, Pages 530–536, 1 October 2013
|
|
|
Chang-Chun Lee,
Yen-Fu Su, Chih-Sheng Wu, and Kuo-Ning Chiang, "Investigation of
interconnect design on interfacial cracking energy of Al/TiN barriers under
a flexural load," Thin Solid Films, Volume 544, Pages 530–536, 1
October 2013
|
|
|
Y. F.
Su,
S. Y. Yang, T. Y. Hung, C. C. Lee, and
K. N. Chiang, "Light degradation test and
design of thermal performance for high-power light-emitting diodes,"
Microelectronics Reliability,
Volume 52, Issue 5,
pp.794-803, 2012
|
Conference Papers
|
|
L. L. Liao, T. Y. Hung, C. K. Liu, Y. F. Su and K. N. Chiang, "Study
on configuration design of interconnection in high power module" EuroSimE
2015, Budapest, Hungary, April 20-22, 2015 |
|
|
H. T. Yang, Y. F. Su and K. N. Chiang, "Research on Packing Effects
of Three-axis SOI MEMS Accelerometer" EuroSimE 2015, Budapest, Hungary,
April 20-22, 2015 |
|
|
F. M. Hsu, Y. F. Su and K. N. Chiang, "Determination of the Junction
Temperature of Gallium Nitride (GaN)-based High Power LED Under Thermal with
Current loading Conditions" ICEP2015, Kyoto, Japan, April 15-17 |
|
|
C. C. Yang, C. C. Tsai, Y. F. Su and K. N. Chiang, "Analysis of LED
Wire Bonding Process Using Arbitrary Lagrangian - Eulerian and Equilibrium
Mesh Smoothing Algorithm" ICEP2015, Kyoto, Japan, April 15-17 |
|
|
T. L. Chou, C. C.
Lee, H. N. Chiang, C. T. Lin, Y. F. Su, and K. N. Chiang, "Study on
Thermal Induced Stress Hysteresis Behavior of Thin Film Sensor," ThinFilms
2014, Chongqing, China, Jul. 15-18, 2014 |
|
|
H. J. Wang,
H. A. Deng, S. Y. Chiang, Y. F. Su,
and K. N. Chiang, "Development of a Feasible Simulation Methodology for
Residual Stress Assessment of Multilayer Thin Film Structure," ThinFilm2014,
Chongqing, China, Jul. 15-18, 2014
|
|
|
Y. H. Yang, Y. F.
Su, and K. N. Chiang, "Acceleration Factor Analysis of Aging Test on
Gallium Nitride (GaN)-based High Power Light-emitting Diode (LED)," ITherm
2014, Orlando, USA, May 27-30, 2014
|
|
|
Y. F. Su, C.T.
Lin, T. Y. Kuo, and K. N. Chiang, "Structure design and reliability assessment
of double-sided with double-chip stacking packaging," EuroSimE 2014, Gent,
Belgien, April 7-9, 2014
|
|
|
L.L. Liao, T. Y. Hung, C. K.
Liua, Y. F. Su, and K. N. Chiang, "Study on configuration design of
interconnection in high power module," EuroSimE 2014, Gent, Belgien, April
7-9, 2014
|
|
|
K.C. Lin, C.C. Tsai,
Y.F. Su, T.Y. Hung, K.N. Chiang, "Analysis of LED Wire Bonding
Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration
Methods", iMPACT2013, Taipei,Taiwan, Oct 23-25, 2013
|
|
|
Y. F. Su, C. T. Lin, T. Y. Kuo, and K. N. Chiang, "Development of
Double-Sided with Double-Chip Stacking Structure using Panel Level
Embedded Wafer Level Packaging," Electronic Components Technology Conference
(ECTC 2013), Las Vegas, NV, USA, May 28-31, 2013
|
|
|
Y. F. Su, Y. H. Yang, W. K. Yang, and K. N. Chiang, "A Thermal
Performance Assessment of Panel Type Packaging (PTP) Technology for High
Efficiency LED," 14th International Conference on Electronics Materials and
Packaging, December 13-16, 2012, Hong Kong.
|
|
|
Y. J. Lee, Y. F. Su, T. Y. Hung, and K. N.
Chiang, "Reliability Analysis of 3D IC Integration packaging under Drop Test
Condition," iMPACT 2012, Taipei, Taiwan, October 24-26
|
|
|
C. C. Lee, Y. F. Su, C. S. Wu, and K. N. Chiang, "Investigation of
Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under
a Flexural Load," ThinFilms2012, Singapore, July 14-17
|
|
|
C. F. Huang, Y. F. Su, S. Y. Yang, C. L. Hsu, N. C. Chen, and K. N.
Chiang, "Quantum Efficiency Investigation at high Current Density of
Ultra-High-Brightness LEDs," ITHERM 2012, San Diego, California, USA, May 30
- June 1
|
|
|
P.
C. Chen, Y. F. Su, S. Y. Yang, and K. N. Chiang, "Determination of
Silicon Die Initial Crack Using Acoustic Emission Technique," iMPACT 2011,
Taipei, Taiwan, October 19-21
|
|
|
Y. F.
Su, S. Y. Yang, T. Y. Hung, C. C. Lee, and
K. N. Chiang, "Light degradation test and
design of thermal performance for high-power light-emitting diodes,"
Microelectronics Reliability, in press
|
|
|
Y. F. Su, S. Y. Yang, W. H. Chi
and K. N. Chiang, "Light degradation prediction of high-power
light-emitting diode lighting modules," in Thermal, Mechanical &
Multi-Physics Simulation, and Experiments in Microelectronics and
Microsystems (EuroSimE), 2010 11th International Conference on,
2010, pp. 1-6. |
|
|
Y. F. Su; T. Y. Hung; S. Y. Yang; K. N.
Chiang, “A Study on the Thermal Performance of a
Chip-in-substrate-type LED Package Structure”, CPMT Symposium Japan,
2010 IEEE, 2010 , pp. 1 - 4. |
|
|
T. H. Kuo, Y. F. Su, C. J. Wu, and K. N. Chiang,
"Stress/Stain Assessment and Reliability Prediction of Through
Silicon Via and Trace Line Structures of 3D Packaging,"
EuroSimE2011, Linz, Austria, April 18-20, 2011. |
|
|
|
L. L.
Liao
E-mail:
powerzero0412@hotmail.com
Journal Papers
|
|
L. L. Liao, T. Y. Huang, C. K.
Liu, W. Li, M. J. Dai, and K. N. Chiang, "Electro-thermal finite element
analysis and verification of power module with aluminum wire",
Microelectronic Engineering, Volume 120, 25 May 2014, Pages 114–120
|
|
|
T. Y. Hung,
L. L. Liao, C. C.
Wang, W. H. Chi, and K. N. Chiang, "Life Prediction of High Cycle Fatigue in
Aluminum Bonding Wires under Power Cycling Test", IEEE Transactions on
device and materials reliability, Available online 05 November 2013, ISSN
1530-4388.
|
|
|
L. L. Liao, M. J. Dai, C. K. Liu,
and K. N. Chiang, "Thermo-electric finite element analysis and
characteristic of thermoelectric generator with intermetallic compound",
Microelectronic Engineering,
Volume 120, 25 May 2014, Pages 194–199
|
Conference Papers
|
|
L. L. Liao, T. Y. Hung, C. K. Liu, Y. F. Su and K. N. Chiang, "Study
on configuration design of interconnection in high power module" EuroSimE
2015, Budapest, Hungary, April 20-22, 2015 |
|
|
L.L. Liao, T.Y. Hung, C.K. Liua,
Y.F. Su, and K.N. Chiang, "Study on configuration design of interconnection
in high power module," EuroSimE 2014, Gent, Belgien, April 7-9, 2014
|
|
|
L. L. Liao, T. Y. Huang, C. K.
Liu, W. Li, M. J. Dai, and K. N. Chiang, "Electro-thermal finite element
analysis and verification of power module with aluminum wire", Materials for
Advanced Metallization Conference, MAM 2013, Leuven, Belgium, Mar. 10-13,
2013
|
|
|
L. L. Liao, M. J. Dai, C. K. Liu,
and K. N. Chiang, "Thermo-electric finite element analysis and
characteristic of thermoelectric generator with intermetallic compound",
Materials for Advanced Metallization Conference, MAM 2013, Leuven, Belgium,
Mar. 10-13, 2013
|
|
|
L. L. Liao, M. J. Dai, C. K. Liu, J. Y. Chang and K. N. Chiang, "
Development and analysis of the thermoelectric material with intermetallic
compound," ICEP 2012, Tokyo, Japan, April 17-21
|
|
|
H. H. Chang,
L. L. Liao and K. N. Chiang, " External Stress Effect to Electromigration on
Thermal Annealed and Residual Stress Controlled Aluminum Strip," ICEP2012,
Tokyo, Japan, April 17-21
|
|
