The Computation Solid Mechanics Laboratory, CSML was established upon August ,1998 with its major research including microelectronic packaging, contact theory, computational solid mechanics and MEMs system. The related basic theory and application of Computer-complemented Engineering and computational solid mechanics are becoming much more practical due to the great promotion and popularization of computer calculating speed. Based on theoretical solid mechanics, the computer simulation technique can reduce a lot experimental cost and time. Through accurate mechanical analysis and microcosmic / macroscopic observation enable researchers to effectively perceive characters of subjects and promote their research and design abilities, as well as tremendous reducing of developing procedure in order to increase competitiveness had become an inevitable trend.
We adopted the experiences of Professor Chiang with his research of GMC, Det NorskeVeritas in Norway, The MacNeal-Schwendler (MSC/NASTRAN) company and National center for High-performance Computing, NCHC. We use computational solid mechanics theory, and advanced computer simulation analysis as our basis and proceed the related experiments and researches. Till nowadays we've already accomplished several projects such as Analysis of puncture of TRTC, the first domestic crashworthiness engineering simulation analysis with YULON-motor, the development of finite element analysis software MSC/NASTRAN of The MacNeal-Schwendlercompany, and so on.
We also kept good relationship with companies like Motorola, Georgia Institute of Technology; we are now working with local semiconductor and packaging companies for the next generation of electronic packaging project. We're now applying for 7 domestic and 6 US electrical structure patents.
Because of
the great promotion and
popularization of computer calculating speed, the computer-aided engineering and
computational-solid-mechanics-related theories and applications become much more
practical. Through
accurate mechanical analysis and microcosmic / macroscopic observation enable
researchers to effectively perceive characters of subjects and promote their
research and design abilities, as well as tremendous reducing of developing
procedure in order to increase competitiveness had become an inevitable trend.
We adopted the experiences of Professor Chiang with his research of GMC, Det NorskeVeritas in Norway, The MacNeal-Schwendler (MSC/NASTRAN) company and National center for High-performance Computing, NCHC. We use computational solid mechanics theory, and advanced computer simulation analysis as our basis and proceed the related experiments and researches. Till nowadays we've already accomplished several projects such as Analysis of puncture of TRTC, the first domestic crashworthiness engineering simulation analysis with YULON-motor, the development of finite element analysis software MSC/NASTRAN of The MacNeal-Schwendlercompany, the reliability and structure design of turbine, the structure and vibration analysis of motorcycle, the engine thermal stress/strain analysis, the analysis software design standard development, and so on.
Recently the
electronic packaging researches have approached to lighter, thinner, smaller, higher
power and more densely devices to meet the requirement of great promotion of
semiconductor products such as computers and mobile phones. Except those
tendencies, electronic packaging has other important characters such as high
reliability, good thermal performance, low cost, and challenges of
time-to-market shrinkage, short product life cycle, across-disciplinary-lines
researches, and patent protections. The rapid exchange of fabrication process of
semiconductor products has brought a tremendous challenge, and the research
infrastructure was impacted by the system integration. Followed by the
minimization of electronic packaging structures, the issues on the reliability
and optimization of electronic packaging structures becomes worthier to
study. In the electronic packaging field, we've emphasized on the researches of Ball
Grid Array structure, eutectic solder reflow analysis, Chip Scale / Wafer Level
Packaging, Flip Chip Structures (including ACA Technology), Structure
Local/Global Analysis, 3D / MCM Packaging Technologies and EP material database
constructions. Furthermore, we also had several internal patents and US
patents about advanced EP structures and technologies.
|
 |
