PowerPoint 簡報
Development of Next Generation Package System
- Chip Scale Package, Wafer Level Packaging and Flip Chip will be the Better Solution for The
Next Generation Packaging System
- Research on Chip Scale and Wafer Level Packaging are Suitable for Mechanical Engineering
- First Step Will Aim for Chip Scale Packaging (CSP) and
Wafer Level Packaging Will be the Next Focus
Key Research Issues Required for Flex CSP
Manufacturing Infrastructure
Surface Mount Technology（環隆）
Solid Mechanics -- Fracture, Visco/Plastic,
Material Science -- Material Characterization,
Manufacturing and Automation
Electronic Packaging Lab. of NTHU