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Thermal Enhanced BGA (256 Solder Balls)

Ball_C

Ball_D

First Reflow, Solder Height = 0.543 mm

Second Reflow, Solder Height = 0.6724 mm

Heat Spreader

Die Attach

Die

BT

Solder Mask

Solder

Ball

Encapsulant

Copper Ring

.

Pad radius : 0.287 mm

g : 45 dynes/mm

Solder Ball Volume : 0.26808 mm3

Load on each Ball : 16.1 dynes

Total Package Weight : 4.2 grams

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