PowerPoint 簡報
1. 召集ASME 電子封裝研討會,"New Directions for Manufacturing Technology: Process Sensoring,
Monitoring, Modeling and Verification in Electronic Packaging Symposium (Nov. 16-21 1997, ASME
Winter Annual Meeting, Dallas, Texas, USA.)
2.主辦, "Package/PCB Electronical Performance in High-Speed Digital System", March 25, 1998.
HsinChu, Taiwan
3.召集ASME 電子封裝研討會，"Advanced Modeling, Simulation, and Validation for Electronic
Packaging Technologies Symposium",INTERPACK'97, ASME, June, Hawaii, U.S.A.
4.召集ASME 電子封裝研討會，"Sensing, Modeling and Simulation in Emerging Electronic
Packaging Symposium (Nov. 1996 ASME Winter Annual Meeting, Atlanta, U.S.A)
5.主辦，"電子封裝之可靠度模擬分析及測試整合研討會", June 25-26, 1996,
國家高速電腦中心，新竹。
6.主辦, "Mechanical/Thermal/Vibration/Optimization Simulation for Electronic Packages
Conference",與清華大學工學院、美國摩托羅拉The Applied Simulation and Modeling
Research Center合辦。Dec. 1996, 國家高速電腦中心，新竹。
7.主辦，“電子構裝技術研討會”, 電腦輔助工程協會主辦,清華大學,台灣積體電路, 日月光半導體及
美國摩托羅拉,等協辦 Sept. 24, 1997, 國家高速電腦中心，新竹
Electronic Packaging Lab. of NTHU