大事紀


	1998.8 老師加入清華園
	1998.8 永得,昌明,振南進入實驗室	$描述: 描述: C:\AppServ\www\csml\history\more-2.gif$
	1998.9 郡文加入實驗室
	1998.9 CSML第一學期展開	$描述: 描述: C:\AppServ\www\csml\history\more-2.gif$


	1999.X永得論文"On Enhancing Eutectic Solder Joint Reliability Using a Second-Reflow-Process Approach"獲IEEE 接受
	1999.6 實驗室網頁獲得工學院網頁設計比賽第一名
	1999.7 治棠,長安,世民,俊德生力軍加入
	1999.7 首批博士班學生昌明,基正,國明搶灘
	1999.9 國欽加入博士班
	1999.9 第一屆學生提論文計畫書
	1999.11 郡文,振南獲ASME接受"Contact Stress Analysis of Chip-on-Glass Assemblies Using the Micro-Bump Bonding Method"
	1999.10 昌明發表"Hybrid Solder Reflow Analysis of Area Array Packages"於MSC年會
	1999.12 昌明發表"Analysis of Reflow Geometry for The Hybrid-Pad-Shapes System of Ball Grid Array Packages"(PDF檔)於中國機械工程師年會
	1999.11 老師率郡文,永得前往美國Motorola, 參加’99 ASME發表….


	2000.2 郡文,基正,永得,國欽,昌明獲國家毫微米實驗室積體電路訓練見習證書
	2000.4 永得,長安於IMAPS報告"An Overview of Solder Bump Shape Prediction Algorithms with Validations"
	2000.6 振南,郡文,永得碩士論文口試
	2000.7 昌駿,永儒,啟銘,曉東,生力軍加入
	2000.7 俊德,長安甄試博士班,搶灘成功
	2000.8 治棠,俊德,世民獲國家毫微米實驗室積體電路訓練見習證書
	2000.10 治棠,世民通過碩士論文資格考
	2000.11 基正發表"Thermal/Machnical analysis of novel c-TSOP using nonlinear FEM method (PDF檔) "於花蓮ANSYS論文發表會
	2000.11 昌明發表"Solder shape design and thermal stress/strain anslysis of Flip Chip Packaging using hybrid method (PDF檔)"於花蓮ANSYS論文發表會
	2000.11 治棠,俊德前往美國Orlando發表"The reliability and parametric study of wafer level package"於ASME 2000 conference
	2000.11 基正發表"Thermal/Machnical analysis of novel c-TSOP using nonlinear FEM method(PDF檔) "於香港EMAT論文發表會
	2000.11 昌明發表"Solder shape design and thermal stress/strain anslysis of Flip Chip Packaging using hybrid method (PDF檔)"於香港EMAT論文發表會
	2000.11 治棠發表"The reliability and parametric study of wafer level package"於中國力學年會
	2000.11 長安發表"Micro-Bump Geometry Prediction Methods for Electronic Packaging(PDF檔) "於中國機械年會
	2000.12 俊德發表"Process and reliability simulation of Flip Chip using anisotropic conductive film"於新加坡EPTC 2000
	2000.12 研究室尾牙聚餐於新竹卡爾登飯店

2001.01 老師喬遷之喜

2001.01 研究室全體於老師新居烤肉

2001.02 研究室全體喝春酒於新竹德森坊

2001.6 治棠,世民碩士論文口試

2001.7 欣怡,正斌,銘鴻,興治,生力軍加入

2001.7 治棠報考博士班,搶灘成功

2001.8 昌駿,永儒獲國家毫微米實驗室積體電路訓練見習證書

2001.10 昌駿,永儒,啟銘,曉東通過碩士論文資格考

2001.12 俊德發表Reliability Analysis of Flip Chip Package Using Contact Finite Element Method.於中國機械工程年會

2002．06 昌駿,永儒,啟銘,曉東碩士論文口試

2002．07 實驗室全體墾丁畢業旅行

2002．07 明澔 , 偉全 , 家豪加入 CSML大家庭

2002．07 昌駿 , 曉東博士班搶灘博士班成功

2002．09 中秋節於老師家烤肉同歡

2002．10 欣怡,正斌,銘鴻,興治碩士論文資格考通過

2002．11 基正發表"A Full-Scale 3D Finite Element Analysis for No-underfill Flip Chip Package"於紐奧良 ASME年會

2002．11 治棠發表"Investigation of Thermal Effect of Packaged CMOS Compatible Pressure Sensor "於紐奧良ASME年會

2002．12 國欽 , 昌明 , 基正參加 ISEM Conference 於台北圓山大飯店

2003．01 實驗室於老爺大飯店舉辦年終尾牙

2003．03 實驗室全體於老師家烤肉喝春酒 , 慶祝新的一年到來

2003．04 治棠發表"The Reliability Analysis and Structure Design for the Fine Pitch Flip Chip BGA Package"於法國 Eurosime 年會

2003．04 長安發表"Design, analysis and validation of vertical probing technology"於法國 Eurosime 年會

2003．04 本實驗室陽光美少男昌明連同基哥快樂相親記^O^

2003．06 欣怡,正斌,銘鴻,興治碩士論文口試通過

2003．06 國明,基哥,國欽博士論文口試通過

2003．07 全實驗室畢業旅行～花東三日快樂遊

2003．07 歡迎建成、政男、展延、明志、宏誠加入CSML

$描述: 描述: C:\AppServ\www\csml\history\more-2.gif$

2003．07 俊德發表"Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor",於美國夏威夷 InterPack 年會

2003．07 昌駿發表"Design and Reliability Analysis of Wafer Level Package with Bubble-Like Buffer Layer",於美國夏威夷 InterPack 年會

2003．11 治棠發表"A Novel Silicon Base Piezoresistive Pressure Sensor Using Front Side Etching Process", 於美國華盛頓 ASME 年會

2003．11 治棠發表"Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies", 於美國華盛頓 ASME 年會

2003．11 昌駿發表"Design and Analysis of Gasket Sealing for Cylinder Head in 2.0L Engine Operation",於雲林斗六ANSYS®研討會

2003．12 昌駿發表"Design and Analysis of Temperature Distribution for 2.0L Cylinder Head in Engine Operation",於台北中國機械工程學會第20屆全國學術研討會

2003．12 昌駿發表"Design and Analysis of Gasket Sealing for Cylinder Head in 2.0L Engine Operation",於台南全國力學會議

2003．12 恭賀本實驗室指導教授江國寧老師榮獲92年國科會傑出研究獎

$描述: 描述: C:\AppServ\www\csml\history\logo\logo-2004.jpg$

2004．01 實驗室於新竹卡爾登大飯店舉行年終尾牙

2004．04 老師帶領俊德、治棠、長安、展延、明志參加第三屆兩岸奈米會議於花蓮東華大學

2004．05 恭賀本實驗室指導教授江國寧老師榮獲美國機械工程師學會會士(ASME Fellow)

2004．05 長安、政男發表"Design and Analysis of Novel WLCSP Structure"於比利時EuroSime研討會

2004．06 治棠發表"Experimental Characterization and Mechanical Behavior Analysis on Intermetallic Compounds of 96.5Sn-3.5Ag and 63Sn-37Pb Solder Bump with Ti-Cu-Ni UBM on Copper Chip",於拉斯維加斯ECTC2004研討會

2004．06 昌駿發表"3D Structure Design and Reliability Analysis of Wafer Level Package with Bubble-like Stress Buffer Layer.",於拉斯維加斯Itherm2004研討會

2004．06 全爺豪哥順利畢業

$描述: 描述: C:\AppServ\www\csml\history\more-2.gif$

2004．07 歡迎振宏、信男、仲融、建嘉生力軍加入CSML大家庭

2004．07 全實驗室畢業旅行～墾丁、高雄、月眉快樂三日遊

2004．09 明志博士班搶灘成功

2004．09 昌明博士班順利畢業

2004．10 展延碩士論文資格考通過

2004．11 昌駿發表"Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies",於日月潭涵碧樓ANSYS 2004 Taiwan Conference

2004．11 俊德發表"Experiment Validation of a Nano-Probe for the AFM based on the Large Deflection Theory",CSME Conference於高雄中山大學

2004．11 俊德發表"Design and Analysis of a Nano-Probe for the AFM based on the Small/Large Deflection Theory",ASME Conference於美國安納罕

2004．11 長安, 政男發表 "Atomistic to Continuum Mechanical Investigation of ssDNA and dsDNA using Transient Finite Element Method,"於香港 Inter-Pacific Workshop on Nanoscience and Nanotechnology Conference

2004．12 昌駿發表"Design of Double Layer WLCSP Using DOE with Factorial Analysis Technology",於新加坡IEEE 2004EPTC 研討會

$描述: 描述: C:\AppServ\www\csml\history\logo\logo-2005.bmp$

2005‧1 實驗室於新竹國賓大飯店舉行年終尾牙

2005‧4 展延發表“Solder Joints Layout Design and Reliability Enhancement of Wafer Level Packaging”，於德國柏林EuroSim研討會

2005‧4 治棠發表“Thermal Performance and Solder Joint Reliability for Board Level Assembly of Modified Leadframe Module,”，於德國柏林EuroSim研討會

2005‧5 長安發表“Investigation of Sequence-Dependent dsDNA Mechanical Behavior using Clustered Atomistic-Continuum Method“，於美國安納罕Nanotech Conference

2005‧5 政男發表“Investigation of Local-Strain Effect of the Nano-Scale Triple Gate Si/SiGe and SiNx/Si Stacking MOS Transistor“於美國安納罕Nanotech Conference

2005‧6 治棠，長安博士班順利畢業。展延碩士班順利畢業。

2005‧7 歡迎修平，昭荏，建仲，沈傑，宗燐加入CSML。展延博士班搶灘成功。

2005‧7 實驗室快樂畢業旅行：峇里島五天行。

2005‧10 明志發表"Reliability Analysis of a New Soft Joint Protection Technology Using in WLCSP."於花蓮ANSYS User Conference

2005‧10 昌駿發表“Hybrid Solder Pad System for Enhancing the Reliability of Wafer Level Packaging,“於花蓮ANSYS User Conference

2005‧10 建嘉發表"Reliability Assessment of Lead-Free Flip Chip Package Using Factorial Design Methodology",於花蓮ANSYS User Conference

2005‧11 昌駿發表“Reliability Analysis of WLCSP Using Tie-Release Crack Prediction Finite Element Technique,”於美國奧蘭多ASME International Mechanical Engineering Congress & Exposition

2005‧12 長安，展延，政男發表 "Design and Analysis of Novel Glass WLCSP Structure."，於新竹National Conference on Theoretical and Applied Mechanics

2005‧12 仲融發表"Numerical Simulation of the Mechanical Properties of Nanoscale Metal Clusters Using the Atomistic-Continuum Mechanics Method."，於法國巴黎European Nano System

2005‧12 政男發表”Investigation of ssDNA molecule using clustered atomistic method and its application to the dsDNA analysis,”於澳洲布里斯班Microelectronics, MEMS, and Nanotechnology

2005‧12 政男發表“ Local-Strain Effect of the SiNx/Si Stacking and Nano-Scale Triple Gate Si/SiGe MOS Transistor”於澳洲布里斯班Microelectronics, MEMS, and Nanotechnology

2005‧12 俊德發表“ Thermal and Mechanical Responses of Thermomechanical Microprobe for High Density Storage Technology,“ 於澳洲布里斯班Microelectronics, MEMS, and Nanotechnology

$描述: 描述: C:\AppServ\www\csml\history\logo\logo-2006.bmp$

2006‧1 實驗室於東京都舉行年終尾牙

2006‧1 建成發表“Electromigration Study of SnAg_3.0Cu_0.5 Flip Chip Solder Bumps”於美國夏威夷Pan Pacific Microelectronics Symposium

2006‧1 俊德發表“Investigation of Nano-Scale Single Crystal Silicon Using the Atomistic-Continuum Mechanics with Stillinger-Weber Potential Function,“於新加坡NanoSingapore

2006‧4 明志發表"Sensitivity Design of Chip-in-Substrate-Package Using DOE with Factorial Analysis Technology," 於義大利Como，EuroSIME2006 International Conference

2006‧4 展延發表"Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package,"於義大利Como，EuroSIME2006 International Conference

2006‧5 仲融發表"Investigation of Carbon Nanotube Mechanical Properties Using The Atomistic-Continuum Mechanics Method."於美國波士頓NSTI Nanotech 2006

2006‧5 政男發表“Investigation of ssDNA Backbone Molecule Mechanical Behavior Using Atomistic-Continuum Mechanics Method”於美國波士頓NSTI Nanotech 2006

2006‧5 建嘉發表"Electromigration Characteristic of SnAg3.0Cu0.5 Flip-Chip Interconnection," 於美國聖地牙哥Electronic Components and Technology Conference (ECTC)

2006‧5 建嘉發表"STABILITY OF J-INTEGRAL CALCULATION IN THE CRACK GROWTH OF COPPER/LOW-K STACKED STRUCTURES,"於美國聖地牙哥ITherm 2006

2006‧6 信男，振宏碩士班順利畢業。昌駿博士班順利畢業。仲融博士班搶灘成功。

2006‧6 建嘉發表"LEAD-FREE FLIP CHIP PACKAGE RELIABILITY AND THE FINITE ELEMENT-FACTORIAL DESIGN METHODOLOGY,"於台北世貿中心IMAPS2006

2006‧6 展延發表"12" to 8" wafer transformationn technique using novvel glass WLCSP structure," 於台北世貿中心IMAPS2006

2006‧6 明志發表"Reliability and Characterization of Novel WLCSP with Fan-Out Capability,"於台北世貿中心IMAPS2006

2006‧6 明志發表"Using FEM-based Method for Sensitivity Design of Chip-in-Substrate-Package," 於台北世貿中心IMAPS2006

2006‧7 歡迎宏安，室瑩，端佑，香鈜加入CSML

2006‧7 明志發表 "Factorial Analysis of Chip-on-Metal WLCSP Technology with Fan-Out Capability,"於新加坡IPFA2006

2006‧8 實驗室畢業旅行：清靜農場，日月潭，廬山，溪頭快樂三日行

2006‧9 建嘉發表"Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging"於韓國濟州島ICEM2006

2006‧9 建嘉發表"A Novel Prediction Technique for Interfacial Crack Growth of Electronic Interconnect"於韓國濟州島ICEM2006

2006‧10 明志發表"The Solder on Rubber (SOR) Interconnection Design and Its Reliability Assessment Based on Shear Strength Test and Finite Element Analysis"於德國Wuppertal，European Symposium Reliability of Electron Devices

2006‧11 宗燐發表"Investigation of packaging effect of silicon-based piezoresistive pressure sensor"於美國芝加哥ASME Intl. Mechanical Engineering Congress and Exposition

2006‧11 政男發表"From Atomic-Level Lattice Structure to Estimate the Silicon Mechanical Bulk Behavior Using the Atomistic-Continuum Mechanics"於香港ACCM-5

2006‧12 仲融發表"Numerical Simulation of the Mechanical Properties of Carbon Nanotube Using the Atomistic-Continuum Mechanics."於法國巴黎European Nano System 2006

2006‧12 修平發表"Reliability Analysis of a Package-on-Package Structure Using Novel WLCSP Technology with Fan-Out Capability"於香港International Conference on Electronics Materials and Packaging

$描述: 描述: C:\AppServ\www\csml\histor1.jpg$

2007‧1 實驗室於新竹饌巴黎餐廳舉行年終尾牙

2007‧4 明志發表“A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology”EuroSIME2007_London, England

2007‧ 仲融發表“Simulation and Validation of CNT Mechanical Properties – The Future Interconnection Material”ECTC 2007_Reno, USA

2007‧ 政男發表“Investigation of dsDNA Molecule Mechanical Behavior Using Atomistic Continuum Mechanics Method”NSTI Nanotech2007_Santa Clara, USA

2007‧ 政男發表“Investigation of Mechanical Strength of The Nanoshell of Bacteriophage Phi-29”NSTI Nanotech2007_Santa Clara, USA

2007‧ 展延發表“Estimation and validation of mechanical properties of single crystal silicon by atomic-level numerical model”ICEM13_Alexandroupolis, Greece

2007‧ 展延發表“Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density RF Multi-chip Module”Thermal Stress 2007_Taipei, Taiwan

2007‧6 昭荏，修平，沈傑，建仲碩士班順利畢業。昭荏博士班成功達陣。

2007‧7 建嘉發表“Thermal management on hot spot elimination / junction temperature reduction for high power density system in package structure”InterPACK 2007_Vancouver, BC, Canada

2007‧7 修平發表“Failure mode and thermal performance analysis of stacked panel level package (PLP)”InterPACK 2007_Vancouver, BC, Canada

2007‧7 歡迎炘岳，偉豪，佐野，仕逸加入CSML

2007‧7 歡迎大陸學生崔可航、雷平艷進行學術交流學程

2007‧8 實驗室畢業旅行：澎湖之看小館之旅

2007‧8 建嘉發表“Study of Lamina Fracture of Cu/Low-k Interconnects Using the J-Integral Method”FEOFS 2007_Urumqi, CHINA

2007‧ 明志發表“A Study of Material Effects for the Panel Level Package (PLP) Technology”IMPACT2007, Taipei, Taiwan

2007‧ 宗燐發表“Investigation of the Hysteresis Phenomenon of A Silicon-based Piezoresistive Pressure Sensor”IMPACT2007, Taipei, Taiwan

2007‧10 明志發表“Reliability Assessment for Solders with a Stress Buffer Layer using Ball Shear Strength Test and Board-level Finite Element Analysis”ESREF 2007_Arcachon, France

2007‧10 建嘉發表“Reliability of Interfacial Adhesion in a Multi-Level Copper/Low-k Interconnect Structure”ESREF 2007_Arcachon, France

2007‧11 宗燐發表“Investigation of Thermal Performance of High-Concentration Photovoltaic Solar Cell Package”EMAP2007_Daejeon, Korea

2007‧11 室瑩發表“Reliability Analysis of Copper Interconnection in System-in-package Structure”EMAP2007_Daejeon, Korea

2007‧12 昭荏發表“Investigation of the mechanical properties of nano-scale metallic crystal structural with point defects”ENS'07_Paris, France

描述: 描述: 2008

2008‧6 宏安，室瑩，端佑碩士班順利畢業。

2008‧7 歡迎寧遠，廷鑫，彥輔加入CSML

2008‧8 實驗室畢業旅行：綠島

2008 宗燐發表“Analysis of Cu/Low-k Structure under Back End of Line Process” MAM2008 Dresden, Germany

2008 偉豪發表“Analysis of Thermal Performance of High Power Light Emitting Diodes Package” EPTC2008 Singapore

2008 端佑發表“Validation and reliability assessment of board level drop test of chip-scale-packaging” ICEM2008 Nanjing, China

2008 明志發表“Reliability Analysis of the Panel Base Package (PBPTM) Technology with Enhanced Cover Layer” IMPACT2008 Taipei, Taiwan

2008 展延發表“Investigation of influences of PCB on board-level drop test by dynamic simulation and modal analysis” IMPACT2008 Taipei, Taiwan。

2008 展延發表“Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact” ESREF 2008 Maastricht, Netherland

2008 仲融發表“Reliability and Thermal Assessment of Stacked Chip-on-Metal Panel Based Package (PBPTM) with Fan-Out Capability” ESTC 2008 London, England

2008 仲融發表“Reliability and Thermal Assessment of Stacked Chip

2008 宗燐發表“Investigation of Thermal Performance of High-Concentration Photovoltaic Solar Cell System” 23rd EU PVSEC Valencia, Spain

2008 香鋐發表“TSV Process Using Bottom-up Cu Electroplating and its Reliability Test” ESTC2008 Greenwich, UK

2008 炘岳發表“Reliability Analysis of Copper Interconnections of System-in-Packaging Structure using Finite Element Method” ICEPT 2008 Shanghai, China

2008 明志發表“A Study of Thermal Performance for the Panel Base Package (PBPTM) Technology” ICEPT 2008 Shanghai, China

2008 明志發表“Trace Line Failure Analysis and Characterization of the Panel Base Package (PBPTM) Technology with Fan-Out Capability” ITherm 2008 Florida, USA

2008 政男發表“Sappire-removed induced the deformation of high power InGaN light emitting diodes” EuroSimE2008 Freiburg im Breisgau, Germany

2008 展延發表“Investigation of Stress-buffer-enhanced Package Subjected to Board-level Drop Test” EuroSimE2008 Freiburg im Breisgau, Germany

2008 仲融發表“Estimation and Validation of Elastic Modulus of Carbon Nanotubes Using Nano-Scale Tensile and Vibrational Analysis” ICCES'08 Hawaii, USA

2008 宗燐發表“Cracking energy estimation of ultra low-k package using novel prediction approach combined with global-local modeling technique” MAM2008 Dresden, Germany

描述: 描述: 2009

2009‧6 偉豪，佐野，仕逸碩士班順利畢業。政男，明志，建嘉，展延博士班順利畢業。

2009‧7 歡迎涵融，佩琦，鍾雍，守勤加入CSML

2009‧8 實驗室畢業旅行：宜蘭

2009 炘岳發表“Warpage Analysis of High Power InGaN Light Emitting Diodes after Laser Lift-off EMAP 2009 Penang, Malaysia

2009 室瑩發表“Non-Uniform Thickness Effect of Die Bonding Interface in

High-Concentration Photovoltaic Module” EMAP 2009 Penang, Malaysia

2009 炘岳發表“Reliability Analysis of Copper Interconnections of System-in-Packaging” IMPACT 2009 Taipei, Taiwan

2009 昭荏發表“Reliability and Parametric Study on Chip Scale Package Under Board-Level Drop Test” IMPACT2009 Taipei, Taiwan

2009 宗燐發表“Fabrication Process Simulation and Reliability Improvement of High- brightness LEDs” ESREF 2009 Arcachon, France

2009 展延發表“Metal trace impact life prediction model for stress buffer enhanced package” EMPC2009 Rimini, Italy

2009 端佑發表“A study of thermal performance for chip-in-substrate package on package” EMPC2009 Rimini, Italy

2009 香鋐發表“3D Stacked Chip Technology Using Bottom-up Electroplated TSVs” ECTC 2009 San Diego, USA

2009 昭荏發表“Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module” EuroSimE 2009 Delft, Netherlands

2009 佐野發表“Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test” EuroSimE 2009 Delft, Netherlands

2009 仲融發表“Die-Cracking Evaluation of Silicon Chip Covered with Polymer Film for 3D Chip Stacking Packages” ICEP 2009 Kyoto, Japan

2009 偉豪發表“Analysis of Thermal Performance for High Power Light Emitting Diodes Lighting Module” ICEP 2009 Kyoto, Japan

2009 仲融發表“Strength Evaluation of Silicon Die for 3D Chip Stacking Packages Using ABF as Dielectric and Barrier Layer in Through-Silicon Via” MAM2009 Grenoble, France

2009 建嘉發表“ Investigation of the Delamination Mechanism of the Thin Film Dielectric Structure in Flip Chip Packages” MAM2009 Grenoble, France

描述: 描述: 2010

2010‧6 寧遠，廷鑫，彥輔碩士班順利畢業。仲融，宗燐博士班順利畢業。

2010‧8 歡迎致廷，彥儒，介凱，于舜, 莉菱加入CSML

2010‧8 實驗室畢業旅行：香港

2010 昭荏發表“Research on Multi-Scale Structural Analysis using the Atomistic-Continuum Equivalent Mechanics” CSWNST-8 Hong Kong

2010 端佑發表“Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies” ASME-IMECE Vancouver, Canada

2010 昭荏發表“Carbon Nanotubes Structural Mechanics Using the Atomistic-Continuum Mechanics and Equivalent Methods” ACCM-7 Taipei, Taiwan

2010 室瑩發表“Life Prediction of High Concentration Photovoltaic Modules Subjected to Thermal Cycling Test” IMPACT2010 Taipei, Taiwan

2010 炘岳發表“Strength Determination of Light-emitting diodes and Chip Structure Design” IMPACT2010 Taipei, Taiwan

2010 炘岳發表“Determination of Maximum Strength and Optimization of LED Chip Structure” ESTC2010 Berlin, Germany

2010 彥輔發表“A Study on the Thermal Performance of a Chip-in-substrate-type LED Package Structure” ICSJ2010 Tokyo, Japan

2010 端佑發表“Thermal Design and Transient Analysis of Insulated Gate Bipolar Transistors of Power Module” Itherm2010 Las Vegas, USA

2010 宗燐發表“Transient Thermal Analysis of High-Concentration Photovoltaic Cell Module Subjected to Coupled Thermal and Power Cycling Test Conditions” Itherm2010 Las Vegas, USA

2010 仲融發表“Delamination Investigation of Copper Bumps in 3D Chip Stacking Packages Using the Modified Virtual Crack Closure Technique” ICEP2010 Sapporo, Japan

2010 室瑩發表“Temperature Dependent Current Crowding Analysis of Insulated Gate Bipolar Transistor” ICEP2010 Sapporo, Japan

2010 彥輔發表“Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules” EuroSimE2010 Bordeaux, France

2010 仲融發表“InterfaciProcess Integration for 3D Chip Stacking with Thin Wafer Handling Technology” MAM2010 Belgium

2010 香鈜發表“Process Integration for 3D Chip Stacking with Thin Wafer Handling Technology” MAM2010 Belgium

2010 室瑩發表“Life Prediction of HCPV Under Thermal Cycling Test Condition” MAM2010 Belgium

2010 宗燐發表“Overview and Applicability of Residual Stress Estimation of Film-Substrate Structure” ICAM2010 Kenting, Taiwan

2010 宏安發表“A Robust Nano-Mechanics Approach for Tensile and Modal Analysis Using Atomistic-Continuum Mechanics Method” ICONN 2010 Sydney, Australia

$描述: 描述: C:\AppServ\www\csml\history1.jpg$

2011‧6 珮綺，守勤，涵融碩士班順利畢業。

2011‧7 歡迎顥之，冠中，湘珺，喻翔加入CSML

2011‧8 實驗室畢業旅行：日本九州

2011‧8 守勤預官考取，同時成功申請晶電研發替代役

2011‧9 歡迎孟佳加入CSML

2011 珮綺發表“Determination and Verification of Silicon Die Strength Using Ball-Breaker Test,” InterPACK 2011, Portland,Oregon, USA

2011 涵融發表“Thin Film ResidualStress Assessment of Capacitive MEMS Microphones Using Process ModelingTechnology,” InterPACK 2011, Portland,Oregon, USA

2011 彥輔發表“Stress/Stain Assessment and Reliability Prediction of Through Silicon Via and Trace Line Structures of 3D Packaging,”EuroSimE2011, Linz, Austria

2011 室瑩發表“Electro-Thermal Analysis of the Insulated Gate Bipolar Transistor Module Subjected to Power Cycling Test Using Specified Boundary Condition Technology,”EuroSimE2011, Linz, Austria

2011 昌駿發表 "Investigation of Stress Effect of Electromigration Behavior of Aluminum Strip," IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

2011 彥輔發表 "Light degradation test and design of thermal performance for high-power light-emitting diodes," Microelectronics Reliability, in press.

2011 宗燐發表 “Overview and applicability of residual stress estimation of film-substrate structure,” Thin Solid Films,”

2011 端佑發表 "Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test," Microelectronics Reliability

2011 宗燐發表“Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III-V material,” Microelectronics Reliability

2011 昭荏發表 "A Robust Nano-Mechanics Approach for Tensile and Modal Analysis Using Atomistic-Continuum Mechanics Method" Computational Materials Science

2011 室瑩發表 "Life Prediction of HCPV under Thermal Cycling Test Condition," Microelectronic Engineering

2011 仲融發表 "Interfacial delamination investigation between copper bumps in 3D chip stacking package by using the modified virtual crack closure technique," Microelectronic Engineering

2011 端佑發表 "Dwell Time Effect and Thermal Fatigue Life Assessment of Power Module," 13th International Conference on Electronics Materials and Packaging

2011 香鈜發表 “Process Integration and Reliability Test for 3D Chip Stacking with Thin Wafer Handling Technology,” in Electronic Components and Technology Conference

2011 珮綺發表 "Determination of Silicon Die Initial Crack Using Acoustic Emission Technique," iMPACT 2011, Taipei, Taiwan

	$描述: 描述: C:\AppServ\www\csml\histor2.jpg$
	2012‧1 香鈜博士班順利畢業 2012‧2 歡迎佾澈加入CSML 2012‧7 致廷，彥儒，介凱，于舜碩士班順利畢業 2012‧7 歡迎佳圻，思妘保雄加入CSML 2012‧8 昭荏，炘岳博士班順利畢業 2012‧8 實驗室畢業旅行：日本大阪 2012 宗燐發表"Thermal Performance Assessment and Validation of High Concentration Photovoltaic Solar Cell Module ," IEEE Transactions on Components Packaging and Manufacturing Technology 2012 彥輔發表"Light degradation test and design of thermal performance for high-power light-emitting diodes," Microelectronics Reliability 2012 喻翔發表"A Thermal Performance Assessment of Panel Type Packaging (PTP) Technology for High Efficiency LED," 14th International Conference on Electronics Materials and Packaging 2012 彥輔發表"Reliability Analysis of 3D IC Integration packaging under Drop Test Condition," iMPACT 2012 2012 彥輔發表"Investigation of Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under a Flexural Load," ThinFilms2012 2012 建富發表"Quantum Efficiency Investigation at high Current Density of Ultra-High-Brightness LEDs," ITHERM 2012 2012 莉菱發表" External Stress Effect to Electromigration on Thermal Annealed and Residual Stress Controlled Aluminum Strip," ICEP2012 2012 莉菱發表" Development and analysis of the thermoelectric material with intermetallic compound," ICEP 2012 2012 致廷發表"Investigation on the Effect of Surface Roughness on the Fracture Strength of SCS," EuroSimE 2012 2012 端佑發表"Residual Stress Effect of Electromigration Behavior on Aluminum Strip," Materials for Advanced Metallization Conference 2012 端佑發表"Thermal Cycling Period Effect of Fatigue Life of the Power Module," Materials for Advanced Metallization Conference 2012 昭荏發表"Analysis of the Mechanical Properties of Si/SiGe Heterostructure using Atomistic-continuum Mechanics with Constraint Equations,"APMC-10, ICONN 2012 & ACMM-22
	$描述: 描述: C:\AppServ\www\csml\history.files\image2013.JPG$
	2013‧7 歡迎至軒逢懋哲嘉加入CSML 2013‧8 鐘雍顥之冠中湘珺喻翔碩士班順利畢業 2013‧8 端佑博士班順利畢業 2013‧9 歡迎宏德加入CSML 2013‧10 建富博士班順利畢業 2013 昭荏發表"Estimation of the Mechanical Property of CNT Ropes Using Atomistic-Continuum Mechanics and the Equivalent Methods," CMC-Computers, Materials, & Continua 2014 建富發表"Research on the degradation of AlGaInP Ultra High Brightness LEDs influenced by ohmic metal design," Microelectronic Engineering 2013 昌駿發表"Investigation of interconnect design on interfacial cracking energy of Al/TiN barriers under a flexural load," Thin Solid Films 2013 端佑發表"Investigation of Solder Crack Behavior and Fatigue Life of the Power Module on Different Thermal Cycling Period," Microelectronic Engineering 2013 佾澈發表"Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test", Publishes at the 15th Electronics Packaging Technology Conference 2013 思妘發表"Reliability Assessment of the Temperature Profiles Effect on the Power Module", Published at The 29th National Conference on Theoretical and Applied Mechanics & The 1st International Conference on Mechanics 2013 佳祈發表"Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration Methods", iMPACT2013 2013 彥輔發表"Development of Double-Sided with Double-Chip Stacking Structure using Panel Level Embedded Wafer Level Packaging," Electronic Components Technology Conference (ECTC 2013) 2013 昭荏發表"The Mechanical Properties of Carbon Nanotubes Ropes Using Atomistic-Continuum Mechanics and the Equivalent Methods", ICCES 2013 2013 端佑發表"Bonding Wire Life Prediction Model of the Power Module under Power Cycling Test," EuroSimE 2013 2013 湘珺發表"The Solder Creep Behavior of Power Module Subject to Temeperature Cycling Test with Different Temperature Profiles," ICEP2013 2013 莉菱發表"Electro-thermal finite element analysis and verification of power module with aluminum wire", Materials for Advanced Metallization Conference 2013 莉菱發表"Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound", Materials for Advanced Metallization Conference 2013 建富發表"Research on the degradation of AlGaInP Ultra High Brightness LEDs influenced by ohmic metal design", Materials for Advanced Metallization Conference
	$描述: 描述: C:\AppServ\www\csml\history.files\image2014.JPG$
	2014‧7 歡迎敏軒智如御庭加入CSML 2014‧8 佾澈思妘碩士班順利畢業 2014 珮綺發表"Evaluation of Die Strength using Finite Element Method with Experiment Validation," IEEE Transactions on Components, Packaging, and Manufacturing Technology 2014 莉菱發表"Electro-thermal finite element analysis and verification of power module with aluminum wire", Microelectronic Engineering 2014 建富發表"Research on Efficiency Droop Mechanism and Improvement in AlGaInP Ultra-High-Brightness LEDs Using the Transient Measurement Method", Solid-State Electronics 2014 端佑發表"Life Prediction of High Cycle Fatigue in Aluminum Bonding Wires under Power Cycling Test", IEEE Transactions on device and materials reliability 2014 莉菱發表"Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound", Microelectronic Engineering 2014 昌駿發表"Investigation of consequent process-induced stress for N-type metal oxide semiconductor field effect transistor with a sunken shallow trench isolation pattern," Thin Solid Films 2014 老師發表"Thermal Stability of Graphene Sheet on the Si Surface under Thermal Processing: A Molecular Dynamics Study" International Conference on the Methods of Aerophysical Research 2014 凱強發表Investigation of solder creep behavior on wafer level CSP under thermal cycling loading,”2014 International Conference on Electronics Packaging (ICEP) 2014 彥輔發表"Study on Thermal Induced Stress Hysteresis Behavior of Thin Film Sensor," ThinFilms 2014 2014 彥輔發表"Development of a Feasible Simulation Methodology for Residual Stress Assessment of Multilayer Thin Film Structure," ThinFilms 2014 2014 彥輔發表"Acceleration Factor Analysis of Aging Test on Gallium Nitride (GaN)-based High Power Light-emitting Diode (LED)," ITherm 2014 2014 彥輔發表"Structure design and reliability assessment of double-sided with double-chip stacking packaging," EuroSimE 2014 2014 莉菱發表"Study on configuration design of interconnection in high power module," EuroSimE 2014 2014 凱強發表"Investigation of Strain Rate Effect on Lifetime Performance of Wafer Level CSP Under Different Thermal Cycling Loading Rate," iMPACT 2014
	$描述: 描述: C:\AppServ\www\csml\history.files\image2015.JPG$
	2015‧2 歡迎嘉誠配綸 Robin 加入CSML 2015‧2 佳圻碩士班順利畢業 2015‧7 歡迎承諺聖達天寧加入CSML 2015‧8 至軒逢懋哲嘉宏德碩士班順利畢業 2015‧8 實驗室畢業旅行：澎湖 2015‧9 彥輔莉菱博士班順利畢業 2015‧9 歡迎茗崎加入CSML 2015 老師發表"Interfacial Topography and Properties of Graphene Sheets on Different Reconstructed Silicon Surfaces," CARBON, Vol. 96, pp. 29-39, Jan 2016. 2015 凱強發表"Reliability Assessment of Packaging Solder Joints Under Different Thermal Cycle Loading Rates," IEEE Transactions on Device and Materials Reliability 2015 珮綺發表"Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique," Journal of Electronic Materials 2015 　 2015 涵融發表"Development of a Process Modeling for Residual Stress Assessment of Multilayer Thin Film Structure,"Thin Solid Films 2015 　 2015 香鈜發表"The Effect of Mechanical Stress on Electromigration Behavior," Journal of Mechanics 2015 　 2015 老師發表"First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal" Intermetallics 2015 　 2015 老師發表"Microstructure Effects on Cutting Forcesand Flow Stress in Ultra‐precision Machining of Polycrystalline Brittle Materials" ASME Journal of Manufacturing Sciences and Engineering 2015 　 2015 老師發表"Physics-based Analysis of Minimum Quantity Lubrication Grinding" International Journal of Advanced Manufacturing Technology 2015 　 2015 哲嘉發表"Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian - Eulerian and Equilibrium Mesh Smoothing Algorithm" ICEP 2015 　 2015 逢懋發表"Determination of the Junction Temperature of Gallium Nitride (GaN)-based High Power LED Under Thermal with Current loading Conditions" ICEP 2015 　 2015 宏德發表"Research on Packing Effects of Three-axis SOI MEMS Accelerometer" EuroSimE 2015 　 2015 莉菱發表"Study on configuration design of interconnection in high power module" EuroSimE 2015 2016.7 歡迎黃安佳翰聿翔少群憲宸加入CSML 2016.8 實驗室畢業旅行：澳洲 2016 吳凱強發表"Characterization on Acceleration-Factor Wquation for packaging-Solder Joint Reliablity"Microelectronics Reliablity,pp 167~172, Oct. 2016 2016 老師發表"Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration" IEEE Transaction on Components, Packaging, and Manufacturing Technology, March 2016 2016 老師發表"Interfacial Topography and Properties of Graphene Sheets on Different Reconstructed Silicon Surfaces," CARBON, pp. 29-39, Jan 2016. 2016 佩倫敏軒發表"Finite element mesh size effect for reliability assessment of WLCSP using different creep theories". 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2016 老師發表"Characteristic study of anand and modified anand creep models for area array type WLCSP". 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2016 凱強發表 "Characterization of thermal cycling ramp rate and dwell time effects on AF (Acceleration Factor) Estimation," Electronic Components Technology Conference (ECTC 2016) 2016 彥輔宏德御庭發表"A Method to Compensate Packaging Effects on three-axis MEMS Accelerometer," ITherm, 2016 2016 莉菱發表"Power cycling test and failure mode analysis of high-power module," ICEP, 2016 2016 敏軒發表"Investigation of thermal cycling maximum temperature effect on fatigue life of WLCSP," ICEP, 2016 2016 彥輔逢懋智如發表"Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes," ICEP, 2016 2017.2 歡迎翔云加入CSML 2017.7 歡迎士瑋育承奕廷佩勳加入CSML 2017.7 實驗室畢業旅行：日本 2017.8 承諺聖達天寧茗崎 Robin 碩士班順利畢業 2017 凱強發表"A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates" Journal of Mechanics, pp35~40 ,February 2017 2017 彥輔發表"Design and Reliability Assessment of Novel 3D-IC Packaging"Journal of Mechanics, pp 193~205 ,April 2017 2017 敏軒發表"A Modified Acceleration Factor Empirical Equation for BGA Type Package" ECTC2017, May 29 - Jun. 2017 2017 老師發表 "Feasibility Evaluation of Creep Model for Failure Assessment of Solder Joint Reliability of Wafer Level Packaging", IEEE Transactions on Device and Materials Reliability, September 2017. 2018 寶雄發表"Design And Reliability Assessment of Stacked FAN-OUT Packaging", SMTA Pan Pacific Microelectronics Conference, February, 2018. 2018.7 歡迎柏瑞驛傑宗樺珉宇加入CSML 2018.7 實驗室畢業旅行：日本 2018.7 Robin 發表"Overview Study of Solder Joint Reliability Due to Creep Deformation", Journal of Mechanics, July 2018 2018.8 佳翰聿翔少群黃安碩士班順利畢業 2018.9 嘉誠發表 "Development of a High Cycle Fatigue Life Prediction Model for Thin Flim Silicon Structures", Journal of Electronic Packaging, Volume140,Issue 3, September 2018. 2018.9 實驗室扇出型多晶片堆疊封裝之電子裝置及形成該裝置之方法獲得專利證書 No.I636537 2019.7 歡迎軒呈柏維聖元冠儒加入CSML 2019.8 實驗室畢業旅行：日本 2019.8 嘉誠博士班順利畢業 2019.8 翔云育承士瑋奕廷佩勳碩士班順利畢業 2019.8 賀 2018亞太地區大專生力學競賽李育承學長榮獲第一名沈奕廷學長榮獲第二名 2020.7 歡迎弘旻柏伸漢翔柏盛加入CSML 2020.8 實驗室畢業旅行：宜花東 2020.8 柏瑞驛傑宗樺珉宇碩士班順利畢業 2021.7 歡迎靖瑜珮芸徐甄之懿泓霖加入CSML 2021.8 軒呈柏維聖元冠儒碩士班順利畢業 2022.7 歡迎煜翔彥全映汝承恩加入CSML 2022.3 清華碩士班順利畢業 2022.8 漢翔柏伸柏盛弘旻碩士班順利畢業 2022.9 Sunil 博士班順利畢業 2023.3 昱瑋博士班順利畢業 2023.7 歡迎明清智安旻頤祐霆加入CSML 2023.8 實驗室畢業旅行：宜花 2023.8 靖瑜珮芸徐甄之懿泓霖碩士班順利畢業 2023.7 歡迎昶旭嘉恩雅琪唯鳳加入CSML 2023.8 煜翔彥全映汝承恩碩士班順利畢業
$描述: 描述: C:\AppServ\www\csml\usuallyuse\back.gif$
$描述: 描述: C:\AppServ\www\csml\usuallyuse\aboutCSML.gif$	$描述: 描述: C:\AppServ\www\csml\usuallyuse\HOME.gif$

$描述: 描述: C:\AppServ\www\csml\usuallyuse\corner1.gif$