2006•5    C. J. Wu declared "Investigation of Carbon Nanotube Mechanical Properties Using The Atomistic-Continuum Mechanics Method." NSTI Nanotech 2006 Conference, Boston, Massachusetts, USA

2006•5    C. N. Han declared “Investigation of ssDNA Backbone Molecule Mechanical Behavior Using Atomistic-Continuum Mechanics Method”, NSTI Nanotech 2006 Conference, Boston, Massachusetts, USA

2006•5    Chiu, C. C. declared "Electromigration Characteristic of SnAg3.0Cu0.5 Flip-Chip Interconnection," Electronic Components and Technology Conference (ECTC), San Diego, CA, USA

2006•5    Chiu, C. C. declared "STABILITY OF J-INTEGRAL CALCULATION IN THE CRACK GROWTH OF COPPER/LOW-K STACKED STRUCTURES," ITherm 2006 Conference, San Diego, CA, USA

C. J. Wu joined in Ph. D class

2006•9    Chiu, C. C. declared "A Novel Prediction Technique for Interfacial Crack Growth of Electronic Interconnect" ICEM2006, Jeju, Korea

2006•11  T. L. Chou  declared "Investigation of packaging effect of silicon-based piezoresistive pressure sensor," ASME Intl. Mechanical Engineering Congress and Exposition, Chicago, USA

2007•7    K. H. Tsui, P.Y. Lei joined CSML for International Academic Exchange

2008       H. H. Chang declared “TSV Process Using Bottom-up Cu Electroplating and its Reliability Test” ESTC2008 Greenwich, UK

2008       S. Y. Yang declared “Reliability Analysis of Copper Interconnections of System-in-Packaging Structure using Finite Element Method” ICEPT 2008, Shanghai, China

2008       M. C. Yew declared “A Study of Thermal Performance for the Panel Base Package (PBPTM) Technology” ICEPT 2008, Shanghai, China

2008       M. C. Yew declared “Trace Line Failure Analysis and Characterization of the Panel Base Package (PBPTM) Technology with Fan-Out Capability”        ITherm 2008,        Florida, USA

2008       C. N. Han declared “Sappire-removed induced the deformation of high power InGaN light emitting diodes” EuroSimE2008, Freiburg im Breisgau, Germany

2008       C. J. Wu declared “Estimation and Validation of Elastic Modulus of Carbon Nanotubes Using Nano-Scale Tensile and Vibrational Analysis” ICCES'08, Hawaii, USA

                  C. N. Han, M. C. Yew, Chiu, C. C., C. Y. Chou got Ph. D. degree

2009•7   H. J. Wang, P. C. Chen, Y. Chung, S. C. Wei joined CSML

2009•8    Graduation trip: Ilan

2009       S. Y. Yang declared “Warpage Analysis of High Power InGaN Light Emitting Diodes after Laser Lift-off        EMAP 2009 Penang, Malaysia

2009       S.Y. Chiang declared “Non-Uniform Thickness Effect of Die Bonding Interface in High-Concentration Photovoltaic Module” EMAP 2009 Penang, Malaysia

2009       S. Y. Yang declared “Reliability Analysis of Copper Interconnections of System-in-Packaging”  IMPACT 2009, Taipei, Taiwan

2009       C. J. Huang declared “Reliability and Parametric Study on Chip Scale Package Under Board-Level Drop Test” IMPACT2009, Taipei, Taiwan

2009       T. L. Chou declared “Fabrication Process Simulation and Reliability Improvement of High- brightness LEDs” ESREF 2009, Arcachon, France

2009       C. Y. Chou declared “Metal trace impact life prediction model for stress buffer enhanced package” EMPC2009,    Rimini, Italy

2009       T. Y. Hung declared “A study of thermal performance for chip-in-substrate package on package”    EMPC2009 Rimini, Italy

2009       H. H. Chang declared “3D Stacked Chip Technology Using Bottom-up Electroplated TSVs” ECTC 2009 San Diego, USA

2009       C. J. Huang declared “Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module” in EuroSimE 2009, Delft, Netherlands

2009       M. Sano declared “Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test” in EuroSimE 2009, Delft, Netherlands

2009       C. J. Wu declared “Die-Cracking Evaluation of Silicon Chip Covered with Polymer Film for 3D Chip Stacking Packages” ICEP 2009, Kyoto, Japan

2009       W. H. Chi declared “Analysis of Thermal Performance for High Power Light Emitting Diodes Lighting Module” ICEP 2009, Kyoto, Japan

2009       C. J. Wu declared “Strength Evaluation of Silicon Die for 3D Chip Stacking Packages Using ABF as Dielectric and Barrier Layer in Through-Silicon Via” MAM2009, Grenoble, France

2009       Chiu, C. C. declared “ Investigation of the Delamination Mechanism of the Thin Film Dielectric Structure in Flip Chip Packages” MAM2009, Grenoble, France

2010•7    C. T. Lai, L. Y. Ju, C. K. Fan, L. Y. Shun, L. L. Ling joined CSML.

2010•8    Graduation trip: HK

2010       C. J. Huang declared “Research on Multi-Scale Structural Analysis using the Atomistic-Continuum Equivalent Mechanics” CSWNST-8, Hong Kong

2010       T. Y. Hung declared “Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies” ASME-IMECE,       Vancouver, Canada

2010       C. J. Huang declared “Carbon Nanotubes Structural Mechanics Using the Atomistic-Continuum Mechanics and Equivalent Methods” ACCM-7, Taipei, Taiwan

2010       S.Y. Chiang declared “Life Prediction of High Concentration Photovoltaic Modules Subjected to Thermal Cycling Test” IMPACT2010, Taipei, Taiwan

2010       S. Y. Yang declared “Strength Determination of Light-emitting diodes and Chip Structure Design” IMPACT2010, Taipei, Taiwan

2010       S. Y. Yang declared “Determination of Maximum Strength and Optimization of LED Chip Structure” ESTC2010, Berlin, Germany

2010       Y. F. Su declared“A Study on the Thermal Performance of a Chip-in-substrate-type LED Package Structure” ICSJ2010, Tokyo, Japan

2010       T. Y. Hung declared“Thermal Design and Transient Analysis of Insulated Gate Bipolar Transistors of Power Module” Itherm2010, Las Vegas, USA

2010       T. L. Chou declared“Transient Thermal Analysis of High-Concentration Photovoltaic Cell Module Subjected to Coupled Thermal and Power Cycling Test Conditions” Itherm2010, Las Vegas, USA

2010       C. J. Wu declared“Delamination Investigation of Copper Bumps in 3D Chip Stacking Packages Using the Modified Virtual Crack Closure Technique” ICEP2010, Sapporo, Japan

2010       S.Y. Chiang declared“Temperature Dependent Current Crowding Analysis of Insulated Gate Bipolar Transistor” ICEP2010, Sapporo, Japan

2010       Y. F. Su declared“Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules” EuroSimE2010, Bordeaux, France

2010       C. J. Wu declared“InterfaciProcess Integration for 3D Chip Stacking with Thin Wafer Handling Technology” MAM2010, Belgium

2010       H. H. Chang declared “Process Integration for 3D Chip Stacking with Thin Wafer Handling Technology” MAM2010, Belgium

2010       S.Y. Chiang declared“Life Prediction of HCPV Under Thermal Cycling Test Condition” MAM2010, Belgium

2010       T. L. Chou declared“Overview and Applicability of Residual Stress Estimation of Film-Substrate Structure”        ICAM2010, Kenting, Taiwan

2010       H. A. Teng declared“A Robust Nano-Mechanics Approach for Tensile and Modal Analysis Using Atomistic-Continuum Mechanics Method” ICONN 2010 Sydney, Australia

2011       Y. F. Su declared“Stress/Stain Assessment and Reliability Prediction of Through Silicon Via and Trace Line Structures of 3D Packaging,”EuroSimE2011, Linz, Austria

2011       S. Y. Yang declared“Electro-Thermal Analysis of the Insulated Gate Bipolar Transistor Module Subjected to Power Cycling Test Using Specified Boundary Condition Technology,”EuroSimE2011, Linz, Austria

2011      H. J. Wang declared“Thin Film Residual Stress Assessment of Capacitive MEMS Microphones Using Process Modeling Technology,”InterPACK 2011, Portland, Oregon, USA

2011      P. C. Chen declared“Determination and Verification of Silicon Die Strength Using Ball-Breaker Test,”InterPACK 2011, Portland, Oregon, USA

2011      H. J. Wang, P. C. Chen, and S. C. Wei got master degree

2011      G. J. Lin, H. C. Chen, H.C. Huang, Y.H. Yang Wei joined CSML

2010•8    Graduation trip: Kyushu